Soldering Paste & Flux

Termopasty Soldering Paste Easy Print Sn96,5Ag3Cu0,5 Soldering Paste 1.4ml

Soldering paste Easy Print Sn96.5Ag3Cu0.5 by AG ThermoPaste, for soldering SMD components in production processes without the need for washing. It is based on No Clean flux type, and its residues do...

Soldering paste Easy Print Sn96.5Ag3Cu0.5 by AG ThermoPaste, for soldering SMD components in production processes without the need for washing. It is based on No Clean flux type, and its residues do not cause corrosion spots. Compatible with all lead-free alloys and offers good adhesion and wetting of the surface.

  • Solder composition: Sn96.5/Ag3/Cu0.5
  • ...
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15 90 €
16 Coins 16 Coins
Delivery Fri, 02 Oct - Thu, 08 Oct
2,50 € to a Skroutz Point
or   3,50 €   shipping cost
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Description

Description

Soldering paste Easy Print Sn96.5Ag3Cu0.5 by AG ThermoPaste, for soldering SMD components in production processes without the need for washing. It is based on No Clean flux type, and its residues do not cause corrosion spots. Compatible with all lead-free alloys and offers good adhesion and wetting of the surface.

  • Solder composition: Sn96.5/Ag3/Cu0.5
  • Density: 4.6 g/cm³
  • Printability: over 8 hours
  • Chloride-free
  • No cleaning required
  • Resistant to mid chip solder balling
  • Component adhesion: for over 24 hours
  • Raking speed: up to 150 mm/s

Manufacturer

See full description

Specifications

Specifications

Product Details

Type
Paste

Quantity

Capacity
1.4 ml

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

See all specifications
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Description & Specifications

Soldering paste Easy Print Sn96.5Ag3Cu0.5 by AG ThermoPaste, for soldering SMD components in production processes without the need for washing. It is based on No Clean flux type, and its residues do not cause corrosion spots. Compatible with all lead-free alloys and offers good adhesion and wetting of the surface.

  • Solder composition: Sn96.5/Ag3/Cu0.5
  • Density: 4.6 g/cm³
  • Printability: over 8 hours
  • Chloride-free
  • No cleaning required
  • Resistant to mid chip solder balling
  • Component adhesion: for over 24 hours
  • Raking speed: up to 150 mm/s

Manufacturer

Product Details

Type
Paste

Quantity

Capacity
1.4 ml

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

15,90 €
2,50 € to a Skroutz Point
or   3,50 €   shipping cost