Soldering paste Easy Print Sn96.5Ag3Cu0.5 by AG ThermoPaste, for soldering SMD components in production processes without the need for washing. It is based on No Clean flux type, and its residues do not cause corrosion spots. Compatible with all lead-free alloys and offers good adhesion and wetting of the surface.
- Solder composition: Sn96.5/Ag3/Cu0.5
- Density: 4.6 g/cm³
- Printability: over 8 hours
- Chloride-free
- No cleaning required
- Resistant to mid chip solder balling
- Component adhesion: for over 24 hours
- Raking speed: up to 150 mm/s
Product Details
- Type
- Paste
Quantity
- Capacity
- 1.4 ml
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.