Thermal pad used where a flexible material with very high thermal conductivity is needed, such as in RAM water block connections, power supply section, and high-temperature SMD components.

Thanks to its new multilayer structure, it is perfect for cooling irregularly shaped components and components placed at different heights. It allows for filling joints from small scratches to visibly irregular surfaces.

Due to its excellent thermal conductivity, it is possible to use washers for components with a large surface area, such as bridges on the motherboard, hard drives, and densely packed elements on the PCB of graphics cards.

The pad can be cut to the desired dimensions. Before use, remove the protective sheet from both sides of the thermal pad. Its thermal conductivity reaches 15 W/mK, which is above average in its category.

• High thermal conductivity 15W/mK
• Ease of application
• Use of high-quality components
• Does not conduct electricity
• Does not cause corrosion, does not harden, and is non-toxic

Dimensions: 120x20x0.5mm. Operating temperature: -60°C to 220°C. It is not recommended to compress the thermal pad to more than half of its nominal thickness.