High performance:

• Very soft, silicone-based with special filler material.
• Excellent thermal conductivity despite extremely low hardness.

Minimization of thermal resistance:

• The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm.
• Compensates for height differences up to 0.2 mm.

Flexible applications:

• Thermally conductive, shock-absorbing, moldable, electrically insulating.
• Available in various sizes and thicknesses, cut to the desired shape.
• Ideal for RAM memories, chipsets, and integrated circuits.

Safe handling:

• Electrically insulating, non-adhesive, and easy to handle.
• Optimal and safe heat transfer.

Bridging gaps:

• Especially suitable for different chip heights.
• Acts as a gap filler material without straining sensitive components.

Availability:

• In 0.5 mm, 1.0 mm, and 1.5 mm options.
• Can be independently cut to any size.