Rosfix ProFlux338 Soldering Kit

• Includes: Liquid solder 138°C, 2 tweezers and 2 needles
• Protection and durability: Creates an organic surface protection (OSP) that protects copper surfaces from oxidation, moisture, and shocks.
• Excellent distribution: Outstanding wetting and precise application on printed circuit boards and soldered areas - ideal for BGA assemblies.
• High-quality soldering: Solder joints are full, bright, and uniform, with no need for cleaning after work.
• Low melting temperature: Melts at 138°C, protecting sensitive electronic components.
• Variety of applications: Ideal for GSM technology, BGA stencils, and precise PCB printing with minimum gaps of 0.3 mm and above.
• Additional accessories: The tweezers and needles facilitate the precise application of solder and flux.

Technical Specifications:

• Solder melting temperature: 138°C
• Application: Soldering, OSP protection, PCB work, and BGA assemblies
• Properties of solder paste: Good conductivity, durability, uniform distribution
• Contents of the kit: Rosfix ProFlux338, liquid solder 138°C, 2x tweezers, 2x needles

Applications:

• High-precision soldering of electronic components
• Working on GSM and BGA assemblies
• Protection of copper surfaces from oxidation and moisture
• Printing precise circuits with minimal gaps