The Gelid 7W/mK thermal pad is used to transfer heat at connections between water-cooling blocks and RAM modules, in power supply sections, and on SMD components. Its soft, flexible structure conforms to irregularly shaped components and is electrically non-conductive.
- Dimensions: 120 × 20 × 1 mm
- Thermal conductivity: 7 W/mK
- Tensile strength: 2 kgf/cm²
- Electrical resistivity: 1 × 1012 Ω·cm
- Breakdown voltage: 10 kV/mm
- Maximum elongation: 150%
- Hardness: 45 Shore A
- Specific gravity: 3.15
- Operating temperature: -40 to 200 °C
- Compliance: ROHS
- Halogens: Halogen-free
- Electrical conductivity: Electrically non-conductive
- Colour
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Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.