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The Gelid Solutions thermal pad has a soft, flexible structure and is designed for applications requiring a thermal conductivity of 7 W/mK. It can be used on water blocks, RAM modules, power components and SMD components, as well as on irregularly shaped components or surfaces with gaps and uneven areas.
It can be cut to the desired size. Before use, remove the protective film from both sides.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.