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Elastic thermally conductive pad for applications where a flexible material with high thermal conductivity is required, such as connecting a water block to RAM memory, power supply components, and SMD elements. Its soft structure allows coverage of irregularly shaped or differently elevated components.
It is not recommended to use the pad when it has been compressed more than half of its nominal thickness.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.