Rosfix Paste for Liquidation (Liquid Lead-Free Solder) XGSP50 42g 183℃ No Clean:

• Ease of Use: No washing required after liquidation, increasing process efficiency.
• Silver Formula: New composition with silver for excellent effectiveness in liquidation.
• Ideal for GSM Technology and BGA Meshes: Ensures the desired imprinting of abrasive areas on BGA boards.
• Pre-Coating: Suitable for pre-luting BGA areas with leaded silver solder.
• Easy Application and Activation: Simple to apply, activated by heating to 183°C.
• Storage: Maintains properties at temperatures of 0°C - 10°C.
• Fixing Agent: Contains an adhesive based on resin and solvent for effective liquidation.

Important Details:

• Melting temperature: 183°C
• Weight: 42g
• Composition: Sn63 / Pb37
• Particle size: 25-38 µm
• Viscosity: 50 (Pa·S)