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Rosfix 3DP2-5E19 Soldering Paste 60gr
Soldering Paste & Flux

Rosfix 3DP2-5E19 Soldering Paste 60gr

Rosfix Solder Paste (liquid tin) XGSP80 60g

  • No cleaning required after soldering: Increases process efficiency.
  • Silver formula: New formula with silver for excellent bonding effectiveness.
  • Usage in...

Rosfix Solder Paste (liquid tin) XGSP80 60g

  • No cleaning required after soldering: Increases process efficiency.
  • Silver formula: New formula with silver for excellent bonding effectiveness.
  • Usage in GSM and BGAP: Ideal for GSM and BGAP technology to achieve the desired solder joint formation on BGA devices.
  • Pre-application of BGA pads with leaded solder:...
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14 99 €

-5% for 2+ products

15 Coins 15 Coins
Delivery Thu, 20 Aug - Mon, 24 Aug
2,50 € to a Skroutz Point
or   3,50 €   shipping cost
Sent from Poland
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Poland
20+ pieces
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Description

Description

Rosfix Solder Paste (liquid tin) XGSP80 60g

  • No cleaning required after soldering: Increases process efficiency.
  • Silver formula: New formula with silver for excellent bonding effectiveness.
  • Usage in GSM and BGAP: Ideal for GSM and BGAP technology to achieve the desired solder joint formation on BGA devices.
  • Pre-application of BGA pads with leaded solder: Excellent for pre-joining BGA pads with leaded tin.
  • Easy application and activation: Activated by heating to 183°C.
  • Storage at 0°C - 10°C: Maintains properties with proper storage.
  • Flux based on resin and solvent: Contains resin and solvent-based flux for effective bonding.

Specifications:

  • Melting temperature: 183°C
  • Weight: 60g
  • Composition: Sn63 / Pb37
  • Particle size: 25-38 µm
  • Viscosity: 50 (Pa·S)

Manufacturer

Manufacturer Details

Warnings & Safety Information
See full description

Specifications

Specifications

Product Details

Type
Paste

Quantity

Weight
60 gr

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

See all specifications
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Description & Specifications

Rosfix Solder Paste (liquid tin) XGSP80 60g

  • No cleaning required after soldering: Increases process efficiency.
  • Silver formula: New formula with silver for excellent bonding effectiveness.
  • Usage in GSM and BGAP: Ideal for GSM and BGAP technology to achieve the desired solder joint formation on BGA devices.
  • Pre-application of BGA pads with leaded solder: Excellent for pre-joining BGA pads with leaded tin.
  • Easy application and activation: Activated by heating to 183°C.
  • Storage at 0°C - 10°C: Maintains properties with proper storage.
  • Flux based on resin and solvent: Contains resin and solvent-based flux for effective bonding.

Specifications:

  • Melting temperature: 183°C
  • Weight: 60g
  • Composition: Sn63 / Pb37
  • Particle size: 25-38 µm
  • Viscosity: 50 (Pa·S)

Manufacturer

Manufacturer Details

Warnings & Safety Information

Product Details

Type
Paste

Quantity

Weight
60 gr

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

14,99 €
2,50 € to a Skroutz Point
or   3,50 €   shipping cost