Skroutz.gr

Rosfix ORR2-ZFNJ Soldering Paste 16gr
Soldering Paste & Flux

Rosfix ORR2-ZFNJ Soldering Paste 16gr

Pink Paste Flux (liquid tin) XG-30 16g No Clean

  • No cleaning required: No washing needed after soldering, increasing process efficiency.
  • Silver formula: New formula with silver for excellent bonding...

Pink Paste Flux (liquid tin) XG-30 16g No Clean

  • No cleaning required: No washing needed after soldering, increasing process efficiency.
  • Silver formula: New formula with silver for excellent bonding effectiveness.
  • Application on GSM and BGAP wires: Ideal for GSM technology and BGAP wires, ensuring desired reflow of solder joints in BGA circuits.
  • Lead-tin BGA...
See full description See full description
8 99 €
9 Coins 9 Coins
Delivery by Thu, 02 Jul
2,50 € to a Skroutz Point
or   3,50 €   shipping cost
Sent from Poland
From Rosfix
Poland
20+ pieces
See Soldering Tool Supplies on the page of Rosfix
What if I change my mind?

No problem, as long as it's within 14 days. We'll come pick it up or you can choose the Skroutz Point that suits you, completely free for up to 2 times per year, and we'll refund your money. Get Skroutz Plus to enjoy unlimited free returns.

Review the product
Product report

Description

Description

Pink Paste Flux (liquid tin) XG-30 16g No Clean

  • No cleaning required: No washing needed after soldering, increasing process efficiency.
  • Silver formula: New formula with silver for excellent bonding effectiveness.
  • Application on GSM and BGAP wires: Ideal for GSM technology and BGAP wires, ensuring desired reflow of solder joints in BGA circuits.
  • Lead-tin BGA pad coverage: Suitable for BGA pad pre-soldering with lead-tin solder.
  • Easy application and activation: Easy to apply with activation through heating at 183°C.
  • Storage at 0°C - 10°C: Maintains properties when stored at appropriate temperatures.
  • Resin and solvent-based flux: Contains resin and solvent-based flux for effective soldering.

Specifications:

  • Melting temperature: 183°C
  • Weight: 16g
  • Composition: Sn63 / Pb37
  • Particle size: 25-38 µm
  • Viscosity: 50 (Pa·S)

Manufacturer

Manufacturer Details

Warnings & Safety Information
See full description

Specifications

Specifications

Product Details

Type
Paste

Quantity

Weight
16 gr

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

See all specifications
Questions

Questions

Do you have a question about the product?

Those users who have this product can help you

Ask for the product

Description & Specifications

Pink Paste Flux (liquid tin) XG-30 16g No Clean

  • No cleaning required: No washing needed after soldering, increasing process efficiency.
  • Silver formula: New formula with silver for excellent bonding effectiveness.
  • Application on GSM and BGAP wires: Ideal for GSM technology and BGAP wires, ensuring desired reflow of solder joints in BGA circuits.
  • Lead-tin BGA pad coverage: Suitable for BGA pad pre-soldering with lead-tin solder.
  • Easy application and activation: Easy to apply with activation through heating at 183°C.
  • Storage at 0°C - 10°C: Maintains properties when stored at appropriate temperatures.
  • Resin and solvent-based flux: Contains resin and solvent-based flux for effective soldering.

Specifications:

  • Melting temperature: 183°C
  • Weight: 16g
  • Composition: Sn63 / Pb37
  • Particle size: 25-38 µm
  • Viscosity: 50 (Pa·S)

Manufacturer

Manufacturer Details

Warnings & Safety Information

Product Details

Type
Paste

Quantity

Weight
16 gr

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

8,99 €
2,50 € to a Skroutz Point
or   3,50 €   shipping cost