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Rosfix A1V3-8E6L Soldering Paste 35gr
Soldering Paste & Flux

Rosfix A1V3-8E6L Soldering Paste 35gr

Liquid Paste (Liquid Electronic Glue) in Syringe XG-Z40 35g No Clean

  • No rinsing necessary: No need to wash after the process, increasing efficiency.
  • Silver formulation: New formula containing silver...

Liquid Paste (Liquid Electronic Glue) in Syringe XG-Z40 35g No Clean

  • No rinsing necessary: No need to wash after the process, increasing efficiency.
  • Silver formulation: New formula containing silver for exceptional fluxing effectiveness.
  • Suitable for GSM and BGAP: Ideal for GSM and BGAP technologies, ensuring desired flux field reproduction in BGA.
  • ...
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16 99 €

-5% for 2+ products

17 Coins 17 Coins
Delivery Wed, 19 Aug - Fri, 21 Aug
2,50 € to a Skroutz Point
or   3,50 €   shipping cost
Sent from Poland
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From Rosfix
Poland
20+ pieces
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Description

Description

Liquid Paste (Liquid Electronic Glue) in Syringe XG-Z40 35g No Clean

  • No rinsing necessary: No need to wash after the process, increasing efficiency.
  • Silver formulation: New formula containing silver for exceptional fluxing effectiveness.
  • Suitable for GSM and BGAP: Ideal for GSM and BGAP technologies, ensuring desired flux field reproduction in BGA.
  • Pre-assembly BGA Paste with Lead Solder: Excellent for pre-assembling BGA joints with lead solder.
  • Easy application and activation: Easy to apply, activated by heating to 183°C. After applying the paste, heat with hot air, infrared, or conventional heating.
  • Storage at 0°C - 10°C: Maintains properties with proper storage.
  • Resin- and solvent-based flow: Contains resin-based and solvent-based formulation for effective fluxing.

Technical Characteristics:

  • Melting temperature: 183°C
  • Weight: 42g
  • Composition: Sn63 / Pb37
  • Particle size: 25-38 µm
  • Viscosity: 50 (Pa·S)

Manufacturer

Manufacturer Details

Warnings & Safety Information
See full description

Specifications

Specifications

Product Details

Type
Paste

Quantity

Weight
35 gr

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

See all specifications
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Questions

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Description & Specifications

Liquid Paste (Liquid Electronic Glue) in Syringe XG-Z40 35g No Clean

  • No rinsing necessary: No need to wash after the process, increasing efficiency.
  • Silver formulation: New formula containing silver for exceptional fluxing effectiveness.
  • Suitable for GSM and BGAP: Ideal for GSM and BGAP technologies, ensuring desired flux field reproduction in BGA.
  • Pre-assembly BGA Paste with Lead Solder: Excellent for pre-assembling BGA joints with lead solder.
  • Easy application and activation: Easy to apply, activated by heating to 183°C. After applying the paste, heat with hot air, infrared, or conventional heating.
  • Storage at 0°C - 10°C: Maintains properties with proper storage.
  • Resin- and solvent-based flow: Contains resin-based and solvent-based formulation for effective fluxing.

Technical Characteristics:

  • Melting temperature: 183°C
  • Weight: 42g
  • Composition: Sn63 / Pb37
  • Particle size: 25-38 µm
  • Viscosity: 50 (Pa·S)

Manufacturer

Manufacturer Details

Warnings & Safety Information

Product Details

Type
Paste

Quantity

Weight
35 gr

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

16,99 €
2,50 € to a Skroutz Point
or   3,50 €   shipping cost