Soldering filler in 100g spools
- Tin content: approximately 60%
- Lead content: approximately 40%
- Melting point: 183 to 190°C
- Diameter: 1.5mm
The soldering adhesive is mainly used in the electronics industry for the production of standard electronic devices and components, electrotechnics, and for soldering components with coatings of tin, tin-lead, cadmium, zinc, and silver.
- Type
- Soldering Wire
- Thickness
- 1.5 mm
- Quantity
- 100 gr
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.