Application brush for protection Koch Chemie Polish and Sealing Pad 45x23 mm in a set of 5 pieces.

The Polish and Sealing Pad is an extremely fine finishing sponge, ideal for the economical and uniform application of sealing and protection products such as 1K Nano or Lack-Polish Gruen P1.01.

Main Features:

• Reduced Height: At just 23 mm high, the Polish and Sealing Pad reduces torque forces, ensuring excellent agility and maximum stability.
• Optimal Networking: The open cell structure and appropriate number of cells contribute to achieving excellent hygiene factors.
• Milled Edge: Offers additional flexibility, allowing the sponge to adapt more easily to the curves of surfaces.
• Velcro Material: Smooth colored Velcro suitable for polishing, ensuring secure and stable attachment to the polishing machine.

Usage Recommendations:

• Application of Sealing Products: Ideal for uniform application of products such as 1K Nano.
• Protection and Finishing: Suitable for applying protection and finishing products, ensuring a smooth and even result.

Instructions for Use:

• Surface Preparation: Ensure that the surface is clean and dry before applying the sponge.
• Sponge Attachment: Attach the Polish and Sealing Pad to the polishing machine using the velcro material.
• Product Application: Apply the sealing or protection product (e.g., 1K Nano) evenly to the surface with the sponge. Use light pressure to ensure uniform and economical application.
• Monitoring the Process: Periodically check the application and adjust the technique if needed.
• Cleaning: Clean the sponge after each use to maintain optimal performance and prevent contamination of the applied product.

Precautions:

• Compatibility: Ensure that the product is compatible with the type of surface and the polishing machine being used.
• Uniform Application: For best results, apply the product evenly and avoid overloading the sponge.