Rosfix Soldering Kit: Solder Paste XGSP50 + Flux RMA-223 with Tip and Nozzle

• Rosfix Solder Paste (Full Saponification) XGSP50 42g 183°C No Clean: No cleaning required after soldering, increasing efficiency and ease of the process.
• Silver Formula: Literally designed with a silver compound for excellent soldering effectiveness and reliable connections.
• Application in GSM and BGAP: Ideal for GSM and BGAP technology, providing excellent representation of solder joints on BGA circuits.
• Specifications:
  • Melting temperature: 183°C
  • Weight: 42g
  • Composition: Sn63 / Pb37
  • Particle size: 25-38 µm
  • Fluidity: 50 (Pa·S)

• Rosfix Flux RMA-223 Solder Flux with Tip and Nozzle: High quality and easy to apply.
• Gel Consistency: Facilitates uniform application of the flux.
• No Clean: NO CLEAN flux, no additional cleaning needed, leaving minimal residues that do not affect the operation of electronic circuits.
• Tip: The set includes a practical tip that facilitates precise and uniform application of the flux.
• Nozzle: Allows careful application in hard-to-reach areas.
• Specifications of Nozzle:
  • Inner diameter: 1.025 mm
  • Outer diameter: 1.275 mm
  • Type: Compatible with flux of 10 mm diameter
  • Volume of flux: 10cc